IEEE

3-D Monolithic Stacking of Complementary-FET on CMOS for Next Generation Compute-In-Memory SRAM

Abstract: Monolithic 3D stacking of complementary FET (CFET) SRAM arrays increases integration density multi-fold while supporting the inherent SRAM advantages of low write power and near-infinite ...
IEEE

Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost Tradeoffs

Abstract: Monolithic 3-D (M3D) integrated circuits (ICs) introduce a new aspect to the physical design problem by stacking dies vertically. We introduce a novel heterogeneous design for M3D ICs, which ...