3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and ...

NEO Semiconductor has just unveiled the development of its new 3D X-AI chip technology, which aims to replace DRAM chips inside of HBM to solve data bus bottlenecks, by enabling AI processing through ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

Chip Architecture Provides up to 3.2 Petaflops with an Implementation Efficiency of More Than 50% for Generative AI PARIS, July 18, 2023 (GLOBE NEWSWIRE) -- VSORA, an innovative startup offering ...

MediaTek unveiled the Dimensity 9400 chip in October 2024. Speculations are rife that the Taiwanese chipmaker is now working on the Dimensity 9500, which may debut in the last quarter of this year. A ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...